Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522352 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, Shaowu Huang, David Edward Fisch | 2019-12-31 |
| 10409677 | Enhanced memory reliability in stacked memory devices | — | 2019-09-10 |
| 10295588 | Wafer testing without direct probing | Javier A. Delacruz | 2019-05-21 |
| 10262717 | DRAM adjacent row disturb mitigation | David Edward Fisch | 2019-04-16 |
| 10169143 | Preferred state encoding in non-volatile memories | — | 2019-01-01 |