Issued Patents 2019
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522499 | Bonded structures | Paul M. Enquist, Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2019-12-31 |
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2019-12-31 |
| 10515926 | System and method for providing 3D wafer assembly with known-good-dies | Hong Shen, Guilian Gao | 2019-12-24 |
| 10508030 | Seal for microelectronic assembly | Rajesh Katkar, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2019-12-17 |
| 10490520 | Multichip modules and methods of fabrication | Rajesh Katkar, Hong Shen | 2019-11-26 |
| 10440822 | Interposers with electrically conductive features having different porosities | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2019-10-08 |
| 10431648 | Making electrical components in handle wafers of integrated circuit packages | Hong Shen, Rajesh Katkar | 2019-10-01 |
| 10396041 | High yield substrate assembly | Ilyas Mohammed, Masud Beroz | 2019-08-27 |
| 10332854 | Anchoring structure of fine pitch bva | Rajesh Katkar, Gabriel Z. Guevara, Xuan Li, Cyprian Emeka Uzoh, Guilian Gao | 2019-06-25 |
| 10325880 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Cyprian Emeka Uzoh, Sangil Lee, Guilian Gao | 2019-06-18 |
| 10304803 | Nanoscale interconnect array for stacked dies | Bongsub Lee, Belgacem Haba, Sangil Lee | 2019-05-28 |
| 10283445 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Wael Zohni, Akash Agrawal | 2019-05-07 |
| 10217720 | Multi-chip modules formed using wafer-level processing of a reconstitute wafer | Rajesh Katkar | 2019-02-26 |
| 10204977 | Making electrical components in handle wafers of integrated circuit packages | Hong Shen, Rajesh Katkar | 2019-02-12 |
| 10177114 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Cyprian Emeka Uzoh, Sangil Lee, Guilian Gao | 2019-01-08 |
| 10178363 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Guilian Gao, Arkalgud R. Sitaram | 2019-01-08 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun +1 more | 2019-01-08 |