Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522499 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2019-12-31 |
| 10446532 | Systems and methods for efficient transfer of semiconductor elements | Cyprian Emeka Uzoh, Gaius Gillman Fountain, Jr. | 2019-10-15 |
| 10366962 | Three dimensional device integration method and integrated device | Gaius Gillman Fountain, Jr. | 2019-07-30 |
| 10312217 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Gaius Gillman Fountain, Jr. | 2019-06-04 |
| 10269708 | Increased contact alignment tolerance for direct bonding | Gaius Gillman Fountain, Jr., Javier A. Delacruz | 2019-04-23 |
| 10262963 | Conductive barrier direct hybrid bonding | — | 2019-04-16 |
| 10204893 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Arkalgud R. Sitaram | 2019-02-12 |