Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522499 | Bonded structures | Paul M. Enquist, Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2019-12-31 |
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2019-12-31 |
| 10446456 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Hong Shen, Charles G. Woychik | 2019-10-15 |
| 10440822 | Interposers with electrically conductive features having different porosities | Bong-Sub Lee, Cyprian Emeka Uzoh, Charles G. Woychik, Liang Wang, Laura Wills Mirkarimi | 2019-10-08 |
| 10381326 | Structure and method for integrated circuits packaging with increased density | Charles G. Woychik, Andrew Cao, Bong-Sub Lee | 2019-08-13 |
| 10283484 | Low cost substrates | Cyprian Emeka Uzoh | 2019-05-07 |
| 10256177 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Charles G. Woychik, Guilian Gao | 2019-04-09 |
| 10204893 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2019-02-12 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2019-01-08 |
| 10178363 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Hong Shen, Liang Wang, Guilian Gao | 2019-01-08 |