Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403510 | Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrate | Michael Newman | 2019-09-03 |
| 10381326 | Structure and method for integrated circuits packaging with increased density | Charles G. Woychik, Arkalgud R. Sitaram, Bong-Sub Lee | 2019-08-13 |