Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Liang Wang +1 more | 2019-12-31 |
| 10354976 | Dies-on-package devices and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Wael Zohni, Belgacem Haba | 2019-07-16 |
| 10332833 | Ultra high performance interposer | Cyprian Emeka Uzoh | 2019-06-25 |
| 10325877 | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces | Javier A. Delacruz, Abiola Awujoola, Ashok S. Prabhu, Christopher W. Lattin | 2019-06-18 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Liang Wang +1 more | 2019-01-08 |