Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490528 | Embedded wire bond wires | Ashok S. Prabhu, Abiola Awujoola, Willmar Subido | 2019-11-26 |
| 10354976 | Dies-on-package devices and methods therefor | Min Tao, Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Belgacem Haba | 2019-07-16 |
| 10283445 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Liang Wang, Akash Agrawal | 2019-05-07 |
| 10211160 | Microelectronic assembly with redistribution structure formed on carrier | Belgacem Haba, Cyprian Emeka Uzoh | 2019-02-19 |