Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490528 | Embedded wire bond wires | Abiola Awujoola, Wael Zohni, Willmar Subido | 2019-11-26 |
| 10354976 | Dies-on-package devices and methods therefor | Min Tao, Hoki Kim, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2019-07-16 |
| 10325877 | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces | Javier A. Delacruz, Abiola Awujoola, Christopher W. Lattin, Zhuowen Sun | 2019-06-18 |
| 10181457 | Microelectronic package for wafer-level chip scale packaging with fan-out | Rajesh Katkar | 2019-01-15 |