Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354945 | Multi-surface edge pads for vertical mount packages and methods of making package stacks | Rajesh Katkar, Javier A. Delacruz, Hoki Kim, Akash Agrawal | 2019-07-16 |
| 10354976 | Dies-on-package devices and methods therefor | Hoki Kim, Ashok S. Prabhu, Zhuowen Sun, Wael Zohni, Belgacem Haba | 2019-07-16 |