Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354945 | Multi-surface edge pads for vertical mount packages and methods of making package stacks | Rajesh Katkar, Min Tao, Javier A. Delacruz, Hoki Kim | 2019-07-16 |
| 10283445 | Bonding of laminates with electrical interconnects | Javier A. Delacruz, Belgacem Haba, Wael Zohni, Liang Wang | 2019-05-07 |