Issued Patents 2019
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522499 | Bonded structures | Paul M. Enquist, Liang Wang, Javier A. Delacruz, Arkalgud R. Sitaram | 2019-12-31 |
| 10515913 | Multi-metal contact structure | Cyprian Emeka Uzoh | 2019-12-24 |
| 10508030 | Seal for microelectronic assembly | Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2019-12-17 |
| 10490520 | Multichip modules and methods of fabrication | Liang Wang, Hong Shen | 2019-11-26 |
| 10475726 | Low CTE component with wire bond interconnects | Cyprian Emeka Uzoh | 2019-11-12 |
| 10431648 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Hong Shen | 2019-10-01 |
| 10410977 | High performance compliant substrate | Cyprian Emeka Uzoh | 2019-09-10 |
| 10354945 | Multi-surface edge pads for vertical mount packages and methods of making package stacks | Min Tao, Javier A. Delacruz, Hoki Kim, Akash Agrawal | 2019-07-16 |
| 10332854 | Anchoring structure of fine pitch bva | Gabriel Z. Guevara, Xuan Li, Cyprian Emeka Uzoh, Guilian Gao, Liang Wang | 2019-06-25 |
| 10290613 | Multiple bond via arrays of different wire heights on a same substrate | Cyprian Emeka Uzoh | 2019-05-14 |
| 10269853 | Image sensor device | — | 2019-04-23 |
| 10217720 | Multi-chip modules formed using wafer-level processing of a reconstitute wafer | Liang Wang | 2019-02-26 |
| 10204977 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Hong Shen | 2019-02-12 |
| 10181457 | Microelectronic package for wafer-level chip scale packaging with fan-out | Ashok S. Prabhu | 2019-01-15 |