Issued Patents 2019
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Zhuowen Sun, Liang Wang +1 more | 2019-12-31 |
| 10515926 | System and method for providing 3D wafer assembly with known-good-dies | Liang Wang, Guilian Gao | 2019-12-24 |
| 10490520 | Multichip modules and methods of fabrication | Liang Wang, Rajesh Katkar | 2019-11-26 |
| 10483248 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Jiro Yota, Viswanathan Ramanathan | 2019-11-19 |
| 10446456 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Charles G. Woychik, Arkalgud R. Sitaram | 2019-10-15 |
| 10431648 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Rajesh Katkar | 2019-10-01 |
| 10350522 | Truncated filter capsule | ZhenWu Lin | 2019-07-16 |
| 10340186 | Method for reducing cross contamination in integrated circuit manufacturing | — | 2019-07-02 |
| 10256177 | Integrated interposer solutions for 2D and 3D IC packaging | Charles G. Woychik, Arkalgud R. Sitaram, Guilian Gao | 2019-04-09 |
| 10204977 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Rajesh Katkar | 2019-02-12 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Zhuowen Sun, Liang Wang +1 more | 2019-01-08 |
| 10178363 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Liang Wang, Guilian Gao, Arkalgud R. Sitaram | 2019-01-08 |