Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483248 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Hong Shen, Viswanathan Ramanathan | 2019-11-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483248 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Hong Shen, Viswanathan Ramanathan | 2019-11-19 |