Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446532 | Systems and methods for efficient transfer of semiconductor elements | Cyprian Emeka Uzoh, Paul M. Enquist | 2019-10-15 |
| 10366962 | Three dimensional device integration method and integrated device | Paul M. Enquist | 2019-07-30 |
| 10312217 | Method for low temperature bonding and bonded structure | Qin-Yi Tong, Paul M. Enquist | 2019-06-04 |
| 10269708 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Javier A. Delacruz | 2019-04-23 |