Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304803 | Nanoscale interconnect array for stacked dies | Liang Wang, Belgacem Haba, Sangil Lee | 2019-05-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10304803 | Nanoscale interconnect array for stacked dies | Liang Wang, Belgacem Haba, Sangil Lee | 2019-05-28 |