Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354942 | Staged via formation from both sides of chip | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2019-07-16 |
| 10262947 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2019-04-16 |
| 10199275 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Ilyas Mohammed | 2019-02-05 |
| 10199519 | Method of making a sensor package with cooling feature | Zhenhua Lu | 2019-02-05 |