Issued Patents 2019
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10181411 | Method for fabricating a carrier-less silicon interposer | Michael Newman, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey | 2019-01-15 |
| 10177114 | Hybrid 3D/2.5D interposer | Charles G. Woychik, Sangil Lee, Liang Wang, Guilian Gao | 2019-01-08 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Charles G. Woychik, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2019-01-08 |