Issued Patents 2017
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704827 | Hybrid bond pad structure | Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Feng-Chi Hung +1 more | 2017-07-11 |
| 9699897 | Pad structure | Szu-Ying Chen, Jeng-Shyan Lin, Jen-Cheng Liu, Chia-Wei Liu, Chung-Chuan Tseng | 2017-07-04 |
| 9673245 | Implant isolated devices and method for forming the same | Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-De Wang, Wen-I Hsu | 2017-06-06 |
| 9673246 | Dual metal for a backside package of backside illuminated image sensor | Chun-Chieh Chuang, Jen-Cheng Liu, Wen-De Wang, Jhy-Ming Hung, Pao-Tung Chen | 2017-06-06 |
| 9666624 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung | 2017-05-30 |
| 9666630 | Semiconductor devices, methods of manufacturing thereof, and image sensor devices | Chun-Chieh Chuang, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung, Min-Feng Kao | 2017-05-30 |
| 9666566 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou +4 more | 2017-05-30 |
| 9653508 | Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips | Jeng-Shyan Lin, Jen-Cheng Liu, Wen-De Wang, Shuang-Ji Tsai, Yueh-Chiou Lin | 2017-05-16 |
| 9640582 | Method of manufacturing image sensor having enhanced backside illumination quantum efficiency | Yin-Kai Liao, Han-Chi Liu, Yuan-Hung Liu, Jen-Cheng Liu | 2017-05-02 |
| 9627326 | Method for forming alignment marks and structure of same | Cheng-Hsien Chou, Sheng-Chau Chen, Chun-Wei Chang, Kai-Chun Hsu, Chih-Yu Lai +7 more | 2017-04-18 |
| 9627430 | Method and apparatus for low resistance image sensor contact | Min-Feng Kao, Jen-Cheng Liu, Feng-Chi Hung, Chun-Chieh Chuang, Shuang-Ji Tsai +1 more | 2017-04-18 |
| 9620548 | Image sensor with wide contact | Tzu-Jui Wang, Jen-Cheng Liu, Tzu-Hsuan Hsu, Yuichiro Yamashita | 2017-04-11 |
| 9613996 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-04-04 |
| 9614000 | Biased backside illuminated sensor shield structure | Shyh-Fann Ting, Feng-Chi Hung, Jhy-Jyi Sze, Ching-Chun Wang | 2017-04-04 |
| 9576999 | Backside structure and methods for BSI image sensors | Chun-Chieh Chuang, Jen-Cheng Liu, Wen-De Wang, Keng-Yu Chou, Shuang-Ji Tsai +1 more | 2017-02-21 |
| 9570497 | Back side illuminated image sensor having isolated bonding pads | Shuang-Ji Tsai, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng | 2017-02-14 |
| 9570503 | Ridge structure for back side illuminated image sensor | Chun-Chieh Chuang, Jen-Cheng Liu, Keng-Yu Chou, Pao-Tung Chen, Wen-De Wang | 2017-02-14 |
| 9559244 | CMOS image sensors and methods for forming the same | Min-Feng Kao, Jen-Cheng Liu, Chun-Chieh Chuang, Hsiao-Hui Tseng, Tzu-Hsuan Hsu | 2017-01-31 |
| 9553020 | Interconnect structure for connecting dies and methods of forming the same | Shu-Ting Tsai, Jen-Cheng Liu, Shih Pei Chou, U-Ting Chen, Chia-Chieh Lin | 2017-01-24 |
| 9543257 | 3DIC interconnect devices and methods of forming same | Shu-Ting Tsai, Jeng-Shyan Lin | 2017-01-10 |
| 9536810 | Flat pad structure for integrating complementary metal-oxide-semiconductor (CMOS) image sensor processes | Yen-Ting Chiang, Ching-Chun Wang, Feng-Chi Hung, Hsiao-Hui Tseng, Ming-Tsong Wang +2 more | 2017-01-03 |
| 9536777 | Interconnect apparatus and method | Jeng-Shyan Lin, Shu-Ting Tsai, Jen-Cheng Liu, Feng-Chi Hung, Shih Pei Chou +2 more | 2017-01-03 |