Issued Patents 2016
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530738 | Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant | Linda Pei Ee Chua, Reza A. Pagaila | 2016-12-27 |
| 9524938 | Package-in-package using through-hole via die on saw streets | Heap Hoe Kuan, Seng Guan Chow | 2016-12-20 |
| 9449932 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Arnel Senosa Trasporto, Linda Pei Ee Chua, Reza A. Pagaila | 2016-09-20 |
| 9443828 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Reza A. Pagaila, Linda Pei Ee Chua | 2016-09-13 |
| 9431331 | Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure | Reza A. Pagaila, Linda Pei Ee Chua | 2016-08-30 |
| 9418941 | Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP | Reza A. Pagaila | 2016-08-16 |
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Kyung-Moon Kim, Jeffrey D. Punzalan, SeungYong Chai +3 more | 2016-08-09 |
| 9406619 | Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die | Reza A. Pagaila, Dioscoro A. Merilo | 2016-08-02 |
| 9406647 | Extended redistribution layers bumped wafer | Heap Hoe Kuan | 2016-08-02 |
| 9368423 | Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package | Arnel Senosa Trasporto, Linda Pei Ee Chua, Asri Yusof | 2016-06-14 |
| 9343429 | Semiconductor device and method of forming double-sided through vias in saw streets | Reza A. Pagaila | 2016-05-17 |
| 9331002 | Semiconductor device and method of forming through vias with reflowed conductive material | Reza A. Pagaila, Linda Pei Ee Chua | 2016-05-03 |
| 9324641 | Integrated circuit packaging system with external interconnect and method of manufacture thereof | Arnel Senosa Trasporto, Linda Pei Ee Chua | 2016-04-26 |
| 9324584 | Integrated circuit packaging system with transferable trace lead frame | Arnel Senosa Trasporto, Linda Pei Ee Chua | 2016-04-26 |
| 9312194 | Integrated circuit packaging system with terminals and method of manufacture thereof | Arnel Senosa Trasporto, Linda Pei Ee Chua | 2016-04-12 |
| 9305873 | Integrated circuit packaging system with electrical interface and method of manufacture thereof | Arnel Senosa Trasporto, Linda Pei Ee Chua | 2016-04-05 |
| 9299644 | Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof | Arnel Senosa Trasporto, Zigmund Ramirez Camacho | 2016-03-29 |
| 9293385 | RDL patterning with package on package system | Reza A. Pagaila, Dioscoro A. Merilo | 2016-03-22 |
| 9293351 | Integrated circuit packaging system with planarity control and method of manufacture thereof | Arnel Senosa Trasporto, Linda Pei Ee Chua, Emmanuel Espiritu | 2016-03-22 |
| 9263361 | Semiconductor device having a vertical interconnect structure using stud bumps | Reza A. Pagaila, Shuangwu Huang, Rajendra D. Pendse | 2016-02-16 |
| 9236352 | Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die | Reza A. Pagaila, Shuangwu Huang, Nathapong Suthiwongsunthorn, Dioscoro A. Merilo | 2016-01-12 |