Issued Patents 2005
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960284 | Rotational and reciprocal radial movement of a sputtering magnetron | Jianming Fu, Zheng Xu | 2005-11-01 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Tony P. Chiang, Gongda Yao, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2005-07-19 |
| 6911124 | Method of depositing a TaN seed layer | Xianmin Tang, Praburam Gopalraja, Suraj Rengarajan, John C. Forster, Jianming Fu | 2005-06-28 |
| 6893541 | Multi-step process for depositing copper seed layer in a via | Tony P. Chiang, Yu D. Cong, Jianming Fu, Howard H. Tang, Anish Tolia | 2005-05-17 |
| 6887353 | Tailored barrier layer which provides improved copper interconnect electromigration resistance | Tony P. Chiang, Barry Chin | 2005-05-03 |
| 6881673 | Integrated deposition process for copper metallization | Imran Hashim, Barry Chin, Bingxi Sun | 2005-04-19 |
| 6875321 | Auxiliary magnet array in conjunction with magnetron sputtering | Rong Tao, Zheng Xu | 2005-04-05 |
| 6852202 | Small epicyclic magnetron with controlled radial sputtering profile | Michael Miller, James Tsung, Daniel C. Lubben, Ilyoung Richard Hong | 2005-02-08 |
| 6841050 | Small planetary magnetron | Ilyoung Richard Hong, James Tsung, Daniel C. Lubben, Nirmalya Maity | 2005-01-11 |