Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949450 | Method for integrated in-situ cleaning and subsequent atomic layer deposition within a single processing chamber | Karl Leeser | 2005-09-27 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2005-07-19 |
| 6893541 | Multi-step process for depositing copper seed layer in a via | Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia | 2005-05-17 |
| 6887353 | Tailored barrier layer which provides improved copper interconnect electromigration resistance | Peijun Ding, Barry Chin | 2005-05-03 |
| 6878402 | Method and apparatus for improved temperature control in atomic layer deposition | Karl Leeser | 2005-04-12 |