AT

Anish Tolia

Applied Materials: 1 patents #266 of 719Top 40%
📍 San Jose, CA: #892 of 2,758 inventorsTop 35%
🗺 California: #7,981 of 26,868 inventorsTop 30%
Overall (2005): #235,954 of 245,428Top 100%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6893541 Multi-step process for depositing copper seed layer in a via Tony P. Chiang, Yu D. Cong, Peijun Ding, Jianming Fu, Howard H. Tang 2005-05-17