YC

Yu D. Cong

Applied Materials: 1 patents #266 of 719Top 40%
📍 Sunnyvale, CA: #343 of 1,070 inventorsTop 35%
🗺 California: #7,981 of 26,868 inventorsTop 30%
Overall (2005): #69,379 of 245,428Top 30%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6893541 Multi-step process for depositing copper seed layer in a via Tony P. Chiang, Peijun Ding, Jianming Fu, Howard H. Tang, Anish Tolia 2005-05-17