HT

Howard H. Tang

Applied Materials: 1 patents #266 of 719Top 40%
📍 San Diego, CA: #445 of 1,672 inventorsTop 30%
🗺 California: #7,981 of 26,868 inventorsTop 30%
Overall (2005): #186,627 of 245,428Top 80%
1
Patents 2005

Issued Patents 2005

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6893541 Multi-step process for depositing copper seed layer in a via Tony P. Chiang, Yu D. Cong, Peijun Ding, Jianming Fu, Anish Tolia 2005-05-17