Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974771 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Fusen Chen, Ling Chen, Walter Glenn, Praburam Gopalraja | 2005-12-13 |
| 6960284 | Rotational and reciprocal radial movement of a sputtering magnetron | Peijun Ding, Zheng Xu | 2005-11-01 |
| 6911124 | Method of depositing a TaN seed layer | Xianmin Tang, Praburam Gopalraja, Suraj Rengarajan, John C. Forster, Peijun Ding | 2005-06-28 |
| 6899796 | Partially filling copper seed layer | Wei Wang, Anantha K. Subramani, Praburam Gopalraja, Jick Yu, Fusen Chen | 2005-05-31 |
| 6893541 | Multi-step process for depositing copper seed layer in a via | Tony P. Chiang, Yu D. Cong, Peijun Ding, Howard H. Tang, Anish Tolia | 2005-05-17 |
| 6884329 | Diffusion enhanced ion plating for copper fill | Wei Wang, Anantha K. Subramani, Praburam Gopalraja, Jick Yu, Fusen Chen | 2005-04-26 |