Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6899796 | Partially filling copper seed layer | Wei Wang, Jianming Fu, Praburam Gopalraja, Jick Yu, Fusen Chen | 2005-05-31 |
| 6884329 | Diffusion enhanced ion plating for copper fill | Wei Wang, Jianming Fu, Praburam Gopalraja, Jick Yu, Fusen Chen | 2005-04-26 |