Issued Patents 2005
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974771 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Fusen Chen, Ling Chen, Walter Glenn, Jianming Fu | 2005-12-13 |
| 6911124 | Method of depositing a TaN seed layer | Xianmin Tang, Suraj Rengarajan, John C. Forster, Jianming Fu, Peijun Ding | 2005-06-28 |
| 6899796 | Partially filling copper seed layer | Wei Wang, Anantha K. Subramani, Jianming Fu, Jick Yu, Fusen Chen | 2005-05-31 |
| 6887786 | Method and apparatus for forming a barrier layer on a substrate | Hong Mei Zhang, Xianmin Tang, John C. Forster, Jick Yu | 2005-05-03 |
| 6884329 | Diffusion enhanced ion plating for copper fill | Wei Wang, Anantha K. Subramani, Jianming Fu, Jick Yu, Fusen Chen | 2005-04-26 |
| 6837975 | Asymmetric rotating sidewall magnet ring for magnetron sputtering | Wei Wang | 2005-01-04 |