HZ

Hong Mei Zhang

Applied Materials: 2 patents #145 of 719Top 25%
📍 Beijing, CA: #21 of 129 inventorsTop 20%
Overall (2005): #52,993 of 245,428Top 25%
2
Patents 2005

Issued Patents 2005

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6919275 Method of preventing diffusion of copper through a tantalum-comprising barrier layer Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more 2005-07-19
6887786 Method and apparatus for forming a barrier layer on a substrate Xianmin Tang, Praburam Gopalraja, John C. Forster, Jick Yu 2005-05-03