Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974771 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Ling Chen, Walter Glenn, Praburam Gopalraja, Jianming Fu | 2005-12-13 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2005-07-19 |
| 6913680 | Method of application of electrical biasing to enhance metal deposition | Bo Zheng, Hougong Wang, Girish Dixit | 2005-07-05 |
| 6899796 | Partially filling copper seed layer | Wei Wang, Anantha K. Subramani, Jianming Fu, Praburam Gopalraja, Jick Yu | 2005-05-31 |
| 6884329 | Diffusion enhanced ion plating for copper fill | Wei Wang, Anantha K. Subramani, Jianming Fu, Praburam Gopalraja, Jick Yu | 2005-04-26 |