Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2005-07-19 |
| 6887353 | Tailored barrier layer which provides improved copper interconnect electromigration resistance | Peijun Ding, Tony P. Chiang | 2005-05-03 |
| 6881673 | Integrated deposition process for copper metallization | Peijun Ding, Imran Hashim, Bingxi Sun | 2005-04-19 |