Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6936906 | Integration of barrier layer and seed layer | Hua Chung, Ling Chen, Mei Chang | 2005-08-30 |
| 6899796 | Partially filling copper seed layer | Wei Wang, Anantha K. Subramani, Jianming Fu, Praburam Gopalraja, Fusen Chen | 2005-05-31 |
| 6887786 | Method and apparatus for forming a barrier layer on a substrate | Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja, John C. Forster | 2005-05-03 |
| 6884329 | Diffusion enhanced ion plating for copper fill | Wei Wang, Anantha K. Subramani, Jianming Fu, Praburam Gopalraja, Fusen Chen | 2005-04-26 |