Issued Patents 2005
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958112 | Methods and systems for high-aspect-ratio gapfill using atomic-oxygen generation | M. Ziaul Karim, Siamak Salimian | 2005-10-25 |
| 6936551 | Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices | Jun Zhao, Timothy Weidman, Rick J. Roberts, Li-Qun Xia, Alexandros T. Demos | 2005-08-30 |
| 6930061 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more | 2005-08-16 |
| 6926926 | Silicon carbide deposited by high density plasma chemical-vapor deposition with bias | Seon-Mee Cho, Hichem M'Saad | 2005-08-09 |
| 6890850 | Method of depositing dielectric materials in damascene applications | Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Li-Qun Xia, Fei Han +5 more | 2005-05-10 |
| 6869896 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more | 2005-03-22 |
| 6858153 | Integrated low K dielectrics and etch stops | Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more | 2005-02-22 |