Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949203 | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene | Chang-Lin Hsieh, Diana Xiaobing Ma, Brian Sy-Yuan Shieh, Gerald Yin, Jennifer Y. Sun +2 more | 2005-09-27 |
| 6902947 | Integrated method for release and passivation of MEMS structures | Jeffrey D. Chinn, Rolf Guenther, Michael Rattner, James A. Cooper, Toi Yue Becky Leung | 2005-06-07 |
| 6858153 | Integrated low K dielectrics and etch stops | Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau, Kuowei Liu +7 more | 2005-02-22 |