Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949203 | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene | Chang-Lin Hsieh, Diana Xiaobing Ma, Brian Sy-Yuan Shieh, Jennifer Y. Sun, Senh Thach +2 more | 2005-09-27 |
| 6858153 | Integrated low K dielectrics and etch stops | Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more | 2005-02-22 |
| 6849193 | Highly selective process for etching oxide over nitride using hexafluorobutadiene | Hoiman Hung, Joseph P. Caulfield, Hongqing Shan, Ruiping Wang | 2005-02-01 |
| 6838635 | Plasma reactor with overhead RF electrode tuned to the plasma | Daniel J. Hoffman | 2005-01-04 |