Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6949203 | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene | Chang-Lin Hsieh, Brian Sy-Yuan Shieh, Gerald Yin, Jennifer Y. Sun, Senh Thach +2 more | 2005-09-27 |