Issued Patents 2004
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815336 | Planarization of copper damascene using reverse current electroplating and chemical mechanical polishing | Shau-Lin Shue | 2004-11-09 |
| 6812069 | Method for improving semiconductor process wafer CMP uniformity while avoiding fracture | Tung-Ching Tseng, Chih-Hsiang Yao | 2004-11-02 |
| 6812043 | Method for forming a carbon doped oxide low-k insulating layer | Tien-I Bao, Chung-Chi Ko, Lih-Ping Li | 2004-11-02 |
| 6806184 | Method to eliminate copper hillocks and to reduce copper stress | Ying-Ho Chen | 2004-10-19 |
| 6770570 | Method of forming a semiconductor device with a substantially uniform density low-k dielectric layer | Lih-Ping Li, Hsin-Hsien Lu | 2004-08-03 |
| 6753259 | Method of improving the bondability between Au wires and Cu bonding pads | Mong-Song Liang, Chen-Hua Yu, Chung-Shi Liu, Jane-Bai Lai | 2004-06-22 |
| 6753607 | Structure for improving interlevel conductor connections | Zhen-Cheng Wu, Yung-Cheng Lu | 2004-06-22 |
| 6753269 | Method for low k dielectric deposition | Lih-Ping Li, Yung-Chen Lu | 2004-06-22 |
| 6753260 | Composite etching stop in semiconductor process integration | Lain-Jong Li, Tien-I Bao, Shwang-Ming Jeng, Jun-Lung Huang, Jeng-Cheng Liu | 2004-06-22 |
| 6740567 | Laminating method for forming integrated circuit microelectronic fabrication | Mong-Song Liang | 2004-05-25 |
| 6736701 | Eliminate broken line damage of copper after CMP | Shau-Lin Shue, Ying-Ho Chen, Wen-Chih Chiou, Tsu Shih | 2004-05-18 |
| 6734110 | Damascene method employing composite etch stop layer | Chung-Shi Liu, Chen-Hua Yu | 2004-05-11 |
| 6734101 | Solution to the problem of copper hillocks | Tien-I Bao, Jeng Shwang-Ming, Chen-Hua Yu, Kuen-Chyr Lee | 2004-05-11 |
| 6734079 | Microelectronic fabrication having sidewall passivated microelectronic capacitor structure fabricated therein | Chi-Feng Huang, Shyh-Chyi Wang, Chih-Hsien Lin, Chun-Hon Chen, Tien-I Bao | 2004-05-11 |
| 6729935 | Method and system for in-situ monitoring of mixing ratio of high selectivity slurry | Shang-Ting Tsai, Ping Chuang, Henry Lo, Chao-Jung Chang, Ping-Hsu Chen +3 more | 2004-05-04 |
| 6727172 | Process to reduce chemical mechanical polishing damage of narrow copper lines | Shwangming Jong, Wen-Chih Chiou | 2004-04-27 |
| 6706577 | Formation of dual gate oxide by two-step wet oxidation | Jih-Churng Twu, Chen-Hua Yu | 2004-03-16 |
| 6689665 | Method of forming an STI feature while avoiding or reducing divot formation | Mo Yu | 2004-02-10 |
| 6686284 | Chemical mechanical polisher equipped with chilled retaining ring and method of using | Chi-Wei Chung, Tung-Ching Tseng, Tsu Shih | 2004-02-03 |
| 6677251 | Method for forming a hydrophilic surface on low-k dielectric insulating layers for improved adhesion | Hsin-Hsien Lu, Aaron Song, Tien-I Bao | 2004-01-13 |
| 6672941 | Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation | Chen-Hua Yu | 2004-01-06 |