Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833323 | Method for forming patterned features at a semiconductor wafer periphery to prevent metal peeling | Chen-Hua Yui | 2004-12-21 |
| 6821896 | Method to eliminate via poison effect | — | 2004-11-23 |
| 6787470 | Sacrificial feature for corrosion prevention during CMP | Chu-Wei Hu, Chen Cheng Chou | 2004-09-07 |
| 6767833 | Method for damascene reworking | Chen-Hua Yu | 2004-07-27 |
| 6736701 | Eliminate broken line damage of copper after CMP | Shau-Lin Shue, Ying-Ho Chen, Wen-Chih Chiou, Syun-Ming Jang | 2004-05-18 |
| 6726535 | Method for preventing localized Cu corrosion during CMP | Kuan-Ku Hung, Chen-Hua Yu | 2004-04-27 |
| 6686284 | Chemical mechanical polisher equipped with chilled retaining ring and method of using | Chi-Wei Chung, Tung-Ching Tseng, Syun-Ming Jang | 2004-02-03 |
| 6682396 | Apparatus and method for linear polishing | Chen-Hua Yu | 2004-01-27 |