Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812069 | Method for improving semiconductor process wafer CMP uniformity while avoiding fracture | Syun-Ming Jang, Chih-Hsiang Yao | 2004-11-02 |
| 6686284 | Chemical mechanical polisher equipped with chilled retaining ring and method of using | Chi-Wei Chung, Tsu Shih, Syun-Ming Jang | 2004-02-03 |