Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6831365 | Method and pattern for reducing interconnect failures | Wen-Kai Wan, Tai-Chun Huang, Chin-Chiu Hsia | 2004-12-14 |
| 6812069 | Method for improving semiconductor process wafer CMP uniformity while avoiding fracture | Tung-Ching Tseng, Syun-Ming Jang | 2004-11-02 |
| 6787484 | Method of reducing visible light induced arcing in a semiconductor wafer manufacturing process | Yun-Cheng Lu | 2004-09-07 |
| 6787803 | Test patterns for measurement of low-k dielectric cracking thresholds | Tai-Chun Huang | 2004-09-07 |
| 6759342 | Method of avoiding dielectric arcing | Lain-Jong Li, Bi-Troug Chen, Syun-Ming Jan | 2004-07-06 |