Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812167 | Method for improving adhesion between dielectric material layers | Yu-Huei Chen | 2004-11-02 |
| 6812135 | Adhesion enhancement between CVD dielectric and spin-on low-k silicate films | Shen-Nan Lee | 2004-11-02 |
| 6806185 | Method for forming low dielectric constant damascene structure while employing a carbon doped silicon oxide capping layer | Chung-Chi Ko | 2004-10-19 |
| 6794295 | Method to improve stability and reliability of CVD low K dielectric | Cheng-Chung Lin | 2004-09-21 |
| 6759342 | Method of avoiding dielectric arcing | Chih-Hsiang Yao, Bi-Troug Chen, Syun-Ming Jan | 2004-07-06 |
| 6756321 | Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant | Chung-Chi Ko, Yung-Cheng Lu, Lih-Ping Li, Yu-Huei Chen, Shu E Ku | 2004-06-29 |
| 6753260 | Composite etching stop in semiconductor process integration | Tien-I Bao, Shwang-Ming Jeng, Syun-Ming Jang, Jun-Lung Huang, Jeng-Cheng Liu | 2004-06-22 |