Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6806207 | Method of depositing low K films | Tzu-Fang Huang, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau, David Cheung +5 more | 2004-10-19 |
| 6784119 | Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau +2 more | 2004-08-31 |
| 6756321 | Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant | Chung-Chi Ko, Lain-Jong Li, Lih-Ping Li, Yu-Huei Chen, Shu E Ku | 2004-06-29 |
| 6753607 | Structure for improving interlevel conductor connections | Zhen-Cheng Wu, Syun-Ming Jang | 2004-06-22 |
| 6743737 | Method of improving moisture resistance of low dielectric constant films | Wai-Fan Yau, David Cheung, Nasreen Chopra, Robert P. Mandal, Farhad Moghadam | 2004-06-01 |
| 6734115 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more | 2004-05-11 |