Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6756321 | Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant | Chung-Chi Ko, Yung-Cheng Lu, Lain-Jong Li, Lih-Ping Li, Yu-Huei Chen | 2004-06-29 |