Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812167 | Method for improving adhesion between dielectric material layers | Lain-Jong Li | 2004-11-02 |
| 6756321 | Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant | Chung-Chi Ko, Yung-Cheng Lu, Lain-Jong Li, Lih-Ping Li, Shu E Ku | 2004-06-29 |
| 6729935 | Method and system for in-situ monitoring of mixing ratio of high selectivity slurry | Shang-Ting Tsai, Ping Chuang, Henry Lo, Chao-Jung Chang, Ping-Hsu Chen +3 more | 2004-05-04 |
| 6706637 | Dual damascene aperture formation method absent intermediate etch stop layer | Yao-Yi Cheng, Sung-Ming Jang, Chen-Hua Yu | 2004-03-16 |