Issued Patents 2004
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821905 | Method for avoiding carbon and nitrogen contamination of a dielectric insulating layer | Shing-Chyang Pan, Shwang-Ming Jeng, Grace H. Ho | 2004-11-23 |
| 6811670 | Method for forming cathode contact areas for an electroplating process | Chung-Shi Liu | 2004-11-02 |
| 6767833 | Method for damascene reworking | Tsu Shih | 2004-07-27 |
| 6764959 | Thermal compensation method for forming semiconductor integrated circuit microelectronic fabrication | Mo Yu, Shih-Chang Chen | 2004-07-20 |
| 6753259 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Mong-Song Liang, Chung-Shi Liu, Jane-Bai Lai | 2004-06-22 |
| 6734053 | Effective MIM fabrication method and apparatus to avoid breakdown and leakage on damascene copper process | Chung-Shi Liu | 2004-05-11 |
| 6734101 | Solution to the problem of copper hillocks | Tien-I Bao, Jeng Shwang-Ming, Syun-Ming Jang, Kuen-Chyr Lee | 2004-05-11 |
| 6734110 | Damascene method employing composite etch stop layer | Syun-Ming Jang, Chung-Shi Liu | 2004-05-11 |
| 6726535 | Method for preventing localized Cu corrosion during CMP | Tsu Shih, Kuan-Ku Hung | 2004-04-27 |
| 6706637 | Dual damascene aperture formation method absent intermediate etch stop layer | Yu-Huei Chen, Yao-Yi Cheng, Sung-Ming Jang | 2004-03-16 |
| 6706577 | Formation of dual gate oxide by two-step wet oxidation | Jih-Churng Twu, Syun-Ming Jang | 2004-03-16 |
| 6703286 | Metal bond pad for low-k inter metal dielectric | Chung-Shi Liu | 2004-03-09 |
| 6686280 | Sidewall coverage for copper damascene filling | Shau-Lin Shue, Mei-Yun Wang | 2004-02-03 |
| 6682396 | Apparatus and method for linear polishing | Tsu Shih | 2004-01-27 |
| 6672941 | Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation | Syun-Ming Jang | 2004-01-06 |