Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6806192 | Method of barrier-less integration with copper alloy | Jing-Cheng Lin, Cheng-Lin Huang, Ching-Hua Hsieh, Shau-Lin Shue | 2004-10-19 |
| 6793797 | Method for integrating an electrodeposition and electro-mechanical polishing process | Shih-Wei Chou, Ming-Hsing Tsai, Winston Shue | 2004-09-21 |
| 6767847 | Method of forming a silicon nitride-silicon dioxide gate stack | Chien-Ming Hu, Chien-Hao Chen, Mo Yu, Shih-Chang Chen | 2004-07-27 |
| 6753259 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Chen-Hua Yu, Chung-Shi Liu, Jane-Bai Lai | 2004-06-22 |
| 6740567 | Laminating method for forming integrated circuit microelectronic fabrication | Syun-Ming Jang | 2004-05-25 |
| 6716753 | Method for forming a self-passivated copper interconnect structure | Shau-Lin Shue | 2004-04-06 |
| 6706629 | Barrier-free copper interconnect | Jing-Cheng Lin, Cheng-Lin Huang, Winston Shue | 2004-03-16 |