Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6803309 | Method for depositing an adhesion/barrier layer to improve adhesion and contact resistance | Chii-Ming Wu | 2004-10-12 |
| 6797144 | Method for reducing surface defects in an electrodeposition process | Hung-Wen Su, Ching-Hua Hsieh, Shau-Lin Shue | 2004-09-28 |
| 6793797 | Method for integrating an electrodeposition and electro-mechanical polishing process | Ming-Hsing Tsai, Winston Shue, Mong-Song Liang | 2004-09-21 |
| 6706166 | Method for improving an electrodeposition process through use of a multi-electrode assembly | Ming-Hsing Tsai | 2004-03-16 |