Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6793797 | Method for integrating an electrodeposition and electro-mechanical polishing process | Shih-Wei Chou, Ming-Hsing Tsai, Mong-Song Liang | 2004-09-21 |
| 6706629 | Barrier-free copper interconnect | Jing-Cheng Lin, Cheng-Lin Huang, Mong-Song Liang | 2004-03-16 |