CH

Cheng-Lin Huang

TSMC: 2 patents #100 of 898Top 15%
Overall (2004): #70,322 of 270,089Top 30%
2
Patents 2004

Issued Patents 2004

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6806192 Method of barrier-less integration with copper alloy Jing-Cheng Lin, Ching-Hua Hsieh, Shau-Lin Shue, Mong-Song Liang 2004-10-19
6706629 Barrier-free copper interconnect Jing-Cheng Lin, Winston Shue, Mong-Song Liang 2004-03-16