Issued Patents 2004
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825520 | Capacitor with a roughened silicide layer | Cheng-Yeh Shih | 2004-11-30 |
| 6815336 | Planarization of copper damascene using reverse current electroplating and chemical mechanical polishing | Syun-Ming Jang | 2004-11-09 |
| 6806192 | Method of barrier-less integration with copper alloy | Jing-Cheng Lin, Cheng-Lin Huang, Ching-Hua Hsieh, Mong-Song Liang | 2004-10-19 |
| 6797144 | Method for reducing surface defects in an electrodeposition process | Hung-Wen Su, Shih-Wei Chou, Ching-Hua Hsieh | 2004-09-28 |
| 6759750 | Method for integrating low-K materials in semiconductor fabrication | Ming-Hsing Tsai | 2004-07-06 |
| 6737352 | Method of preventing particle generation in plasma cleaning | Chung-Shi Liu, Chen-Hua Ya | 2004-05-18 |
| 6736701 | Eliminate broken line damage of copper after CMP | Ying-Ho Chen, Wen-Chih Chiou, Tsu Shih, Syun-Ming Jang | 2004-05-18 |
| 6723639 | Prevention of post CMP defects in Cu/FSG process | Chung-Shi Liu | 2004-04-20 |
| 6716753 | Method for forming a self-passivated copper interconnect structure | Mong-Song Liang | 2004-04-06 |
| 6686280 | Sidewall coverage for copper damascene filling | Mei-Yun Wang, Chen-Hua Yu | 2004-02-03 |