Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6806184 | Method to eliminate copper hillocks and to reduce copper stress | Syun-Ming Jang | 2004-10-19 |
| 6753249 | Multilayer interface in copper CMP for low K dielectric | Jih-Churng Twu, Weng Chang | 2004-06-22 |
| 6736701 | Eliminate broken line damage of copper after CMP | Shau-Lin Shue, Wen-Chih Chiou, Tsu Shih, Syun-Ming Jang | 2004-05-18 |
| 6733373 | Polishing assembly for a linear chemical mechanical polishing apparatus and method for forming | Chia-Ming Yang, Chin-Hsin Peng, Jian-Lin Hwang | 2004-05-11 |